Inexpensive 'nanoglue' can bond nearly anything together

Troy, N.Y. -- Researchers at Rensselaer Polytechnic Institute have developed a new method to bond materials that don’t normally stick together. The team’s adhesive, which is based on self-assembling nanoscale chains, could impact everything from next-generation computer chip manufacturing to energy production.Less than a nanometer – or one billionth of a meter – thick, the nanoglue is inexpensive to make and can withstand temperatures far higher than what was previously envisioned. In fact, the adhesive’s molecular bonds strengthen when exposed to heat.The glue material is already commercially available, but the research team’s method of treating the glue to dramatically enhance its “stickiness” and heat resistance is completely new. The project, led by Rensselaer materials science and engineering professor Ganapathiraman Ramanath, is featured in the May 17 issue of the journal Nature.Like many key scientific discoveries, Ramanath and his team happened upon the novel, heat-hardened nanoglue by accident.